LDMOS chiller made of pure copper

General industry

TruPrint

Copper

Additive manufacturing

The use of an additively manufactured cooler made of pure copper boosts cooling capacity for the LDMOS chips (laterally-diffused metal-oxide semiconductor chips) and permits over-clocking to enhance performance. The printed copper has a heat conductivity of 394 W/(m*K).

Pure copper cooling

Improved cooling efficiency

€30 per part

100% IACS conductivity

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Facts & figures about the example part

Material: pure copper

Weight: 13.7 g

Build time: 24 h (75 parts for 100 mm round substrate plate)

Created by: TRUMPF

The design is optimized for maximum cooling capacity with simultaneously low volume.

Michael Thielmann

TRUMPF Laser and System Technology

Find out more about the product

TruPrint 5000 Green Edition

The TruPrint 5000 Green Edition is the medium-format 3D printing system for processing reflective materials such as copper or precious metals. As such, the 3D printer opens up new opportunities for additive manufacturing of large components, induction coils or components for complex cooling applications, e.g. for power electronics and optoelectronics.

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