High-efficiency cooler for electronics
The cooler has improved cooling through internal conformal cooling channels and flexible production with additive manufacturing.
Improved cooling
High conductivity
Flexible production
Facts & figures for an example part
Material: pure copper
Weight: 190 g
Build time: 32.5 h for round substrate plate with 100 mm
Number of layers: 3,217, ea. 30 µm
Created by: TRUMPF
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