High-efficiency cooler for electronics
General industry
TruPrint
Copper
Additive manufacturing
The cooler has improved cooling through internal conformal cooling channels and flexible production with additive manufacturing.
Improved cooling
High conductivity
Flexible production
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Facts & figures for an example part
Material: pure copper
Weight: 190 g
Build time: 32.5 h for round substrate plate with 100 mm
Number of layers: 3,217, ea. 30 µm
Created by: TRUMPF
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